Methods of reducing silicon consumption, methods of forming a semiconductor structure, and methods of forming isolation structures
AssigneeMicro Technology, Inc.
InventorGurtej S. Sandhu
Life of this patent
Estimating the term…
Abstract
A method of reducing silicon consumption of a silicon material. The method comprises cleaning a silicon material and subjecting the cleaned silicon material to a vacuum anneal at a temperature below a melting point of silicon and under vacuum conditions. The silicon material is subjected to additional process acts without substantially removing silicon of the silicon material. Additional methods of forming a semiconductor structure and forming isolation structures are also disclosed.
Claims20
A method of reducing silicon consumption of a silicon material, comprising:
- cleaning a silicon material;
- subjecting the cleaned silicon material to an anneal at a temperature below a melting point of silicon and under vacuum conditions;
- and
- conducting additional process acts on the cleaned silicon material without substantially removing silicon of the silicon material.
A method of forming a semiconductor structure, comprising:
- cleaning a silicon material;
- vacuum annealing the silicon material;
- and
- forming an insulating material on the silicon material,
- wherein the cleaning, the vacuum annealing, and the forcing are conducted in a single processing apparatus.
A method isolation structures in a single processing apparatus, the method comprising:
- vacuum annealing a silicon material comprising trenches therein, the silicon material being substantially free from contaminants;
- and
- forming an insulating material in the trenches,
- wherein the vacuum annealing and the forming are conducted in a single processing apparatus.
A method of forming a semiconductor structure, comprising:
- cleaning a silicon material;
- vacuum annealing the silicon material;
- and
- forming silicon dioxide on the silicon material without substantially removing silicon of the silicon material.
Dependencies are inferred from the claim text.