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US 2019/0355577 A1Published application
Method for printing micro line pattern using inkjet technology
AssigneeUnijet Co., Ltd.
InventorSeog-soon KIM
Life of this patent
Estimating the term…
Abstract
A method for printing a micro line pattern using inkjet printing, includes: a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate; and a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump.
Claims12
A method for printing a micro line pattern using inkjet printing, the method comprising:
- a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate;
- and
- a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump.
Dependencies are inferred from the claim text.