US 2019/0355574 A1 · SUBSTRATE PROCESSING METHOD, RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS

Abstract

A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.

Claims20

Dependent claims

A substrate processing method, comprising:

forming a liquid film of a protection liquid on a surface of a substrate;
drying, by using a supercritical fluid, the substrate to remove the protection liquid from the surface of the substrate;
and
removing a particle remaining on the surface of the substrate after the drying of the substrate.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/411,404Filed 14 May 2019

Priority

JP 2018-09396415 May 2018

Published

21 Nov 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10P 70/80
Cleaning of wafers, substrates or parts of devices: cleaning only by supercritical fluids
H10P 72/0458
Characterised by the layout of the process chambers: vertical arrangement
F26B 3/28
Drying solid materials or objects by processes involving the application of heat: by radiation, e.g. from the sun
H10P 70/20
Cleaning of wafers, substrates or parts of devices: cleaning during device manufacture

Substrate processing method, recording medium and substrate processing apparatus

Life of this patent

Substrate processing method, recording medium and substrate processing apparatus

Life of this patent

Abstract

Claims20