Loading patent…
AssigneeTokyo Electron Limited
InventorsSatoru SHIMURA, Masashi ENOMOTO
Estimating the term…
A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate.
A film forming system for forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming system comprising:
A film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising:
A film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising:
A computer-readable storage medium storing a program running on a computer of a controller configured to control a film forming system to cause the film forming system to execute a film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof,
A computer-readable storage medium storing a program running on a computer of a controller configured to control a film forming system to cause the film forming system to execute a film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof,
Dependencies are inferred from the claim text.