A method of manufacturing an integrated circuit (IC) device, the method comprising:
- forming a photoresist layer on a substrate;
- and
- exposing the photoresist layer to light by using a photolithographic apparatus including a light generator,
- wherein the light generator includes:
- a chamber having a plasma generation space,
- an optical element in the chamber, and
- a debris shielding assembly between the optical element and the plasma generation space in the chamber,
- wherein the debris shielding assembly includes:
- a protective film facing the optical element and being spaced apart from the optical element with a protective space therebetween, the protective space including an optical path, and
- a protective frame to support the protective film and to shield the protective space from the plasma generation space.