Wafer support table
AssigneeNGK Insulators, Ltd.
InventorTomohiro TAKAHASHI
Life of this patent
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Abstract
A wafer support table in which an RF electrode and a heater electrode are buried inside a circular-plate-shaped ceramic substrate having a wafer placing surface in this order from a wafer placing surface side, wherein the RF electrode is constituted by a plurality of RF zone electrodes provided in respective zones on an identical plane, and the plurality of RF zone electrodes and the heater electrode are independently connected to a plurality of conductors for RF zone electrode and a conductor for heater electrode that are provided on an outer side of a surface of the ceramic substrate opposite to the wafer placing surface.
Claims8
A wafer support table in which an RF electrode and a heater electrode are buried inside a circular-plate-shaped ceramic substrate having a wafer placing surface in this order from a wafer placing surface side, wherein
- the RF electrode is constituted by a plurality of RF zone electrodes provided in respective zones on an identical plane, and
- the plurality of RF zone electrodes and the heater electrode are independently connected to a plurality of conductors for RF zone electrode and a conductor for heater electrode that are provided on an outer side of a surface of the ceramic substrate opposite to the wafer placing surface.
Dependencies are inferred from the claim text.