Solid electrolytic capacitor and method of manufacturing the same

A method of manufacturing a solid electrolytic capacitor, comprising:

• preparing at least one capacitor element that includes a linear-shaped valve metal substrate that extends in an axial direction and includes a porous portion on a surface of a core portion, a dielectric layer on a surface of the porous portion, and a cathode layer on the dielectric layer;
• mounting the capacitor element on a cathode terminal that includes a recessed portion having an inner wall surface extending in the axial direction by placing the at least one capacitor element in the recessed portion and electrically connecting the cathode layer of the at least one capacitor element to the inner wall surface of the recessed portion;
• sealing the at least one capacitor element mounted on the cathode terminal with a sealing material;
• and
• electrically connecting an anode terminal to the core portion of the at least one capacitor element.

A method of manufacturing a solid electrolytic capacitor, comprising:

• preparing a plurality of capacitor elements each of which includes a linear-shaped valve metal substrate that extends in an axial direction and includes a porous portion on a surface of a core portion, a dielectric layer on a surface of the porous portion, and a cathode layer on the dielectric layer;
• mounting the plurality of capacitor elements on a collective frame that has a plurality of recessed portions each of which has an inner wall surface extending in the axial direction by placing a respective capacitor element of the plurality of capacitor elements in each of the recessed portions of the collective frame and electrically connecting the cathode layer of the respective capacitor element to the inner wall surface of the recessed portion;
• simultaneously sealing the plurality of capacitor elements mounted on the collective frame with a sealing material;
• dividing the collective frame to obtain a plurality of individual chips where a divided portion of the collective frame of each of the plurality of chips is a cathode terminal;
• and
• electrically connecting an anode terminal to the core portion of the respective capacitor element of each of the plurality of individual chips.