Forced Flow Cooling Temperature Control Method, System, and Apparatus

A method of providing forced flow cooling in a circuit card environment, the method comprising:

• providing an apparatus including:
• at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane, the first and second circuit card subassemblies being connected together by a laterally extending card connector oriented in a parallel lateral-longitudinal plane to the first and second circuit card subassemblies,
• a housing defining a housing internal volume,
• a first temperature inlet coupling being laterally aligned with the first circuit card subassembly,
• a first temperature outlet coupling being laterally aligned with the first circuit card subassembly and longitudinally spaced upon the housing from the first temperature inlet coupling,
• a second temperature inlet coupling being laterally aligned with the second circuit card subassembly, and
• a second temperature outlet coupling being laterally aligned with the second circuit card subassembly and longitudinally spaced upon the housing from the second temperature inlet coupling;
• configuring the first circuit card subassembly for operation at a first operating temperature;
• configuring the second circuit card subassembly for operation at a second operating temperature which is different from the first operating temperature;
• completely surrounding the circuit card with the housing internal volume;
• routing a first temperature-control fluid into the housing through the first temperature inlet coupling;
• routing the first temperature-control fluid out of the housing through the first temperature outlet coupling;
• routing a second temperature-control fluid into the housing through the second temperature inlet coupling;
• routing the second temperature-control fluid out of the housing through the second temperature outlet coupling;
• directing the first temperature-control fluid is laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path;
• directing the second temperature-control fluid laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path;
• and
• inducing the first operating temperature via the first flow path concurrently with inducing the second operating temperature via the second flow path.