Electronics cooling module
AssigneeGE Aviation Systems LLC
InventorsNader Dariavach, Michel Engelhardt, Liqiang Yang
Life of this patent
Estimating the term…
Abstract
A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.
Claims24
A liquid cooling module for cooling a silicon carbide electronic component, comprising:
- a housing supporting the silicon carbide electronic component, the housing having a cavity containing a liquid metal within a liquid flow channel thermally coupled to the silicon carbide electronic component, with the liquid flow channel defining a closed cooling loop;
- a cold plate supporting the housing and having a cooling channel containing a liquid coolant and thermally coupled to the liquid flow channel via the housing;
- a pump configured to pump the liquid coolant through the cooling channel;
- a channel impeller located in the cooling channel of the cold plate for circulating the liquid coolant through the cooling channel;
- a housing impeller positioned in the cavity for circulating the liquid metal through the cooling loop;
- and
- a shaft extending through the housing and cold plate and coupling the housing impeller to the channel impeller such that rotation of the channel impeller drives rotation of the housing impeller.
(canceled)
4-6. (canceled)
8-11. (canceled)
A method of cooling a heat generating silicon carbide electronic component, the method comprising:
- driving rotation of a housing impeller to flow liquid metal coolant through a closed-loop liquid flow channel in a housing supporting the silicon carbide electronic component;
- driving rotation of a channel impeller via the housing impeller to flow a second coolant through a cooling channel thermally coupled to the liquid flow channel and located in a cold plate supporting the housing;
- transferring heat from the silicon carbide electronic component to the liquid metal coolant;
- and
- transferring heat from the liquid metal coolant to the second coolant.
16-20. (canceled)
An electronics chassis for an aircraft, comprising:
- a chassis housing defining an interior;
- an avionics system located within the interior and having at least one electronic component;
- and
- a liquid cooling module, comprising:
- a housing supporting the at least one electronic component, the housing having a cavity containing a liquid metal within a liquid flow channel thermally coupled to the at least one electronic component, with the liquid flow channel defining a closed cooling loop;
- a cold plate supporting the housing and having a cooling channel containing a liquid coolant and thermally coupled to the liquid flow channel via the housing;
- a pump configured to pump the liquid coolant through the cooling channel;
- a channel impeller located in the cooling channel of the cold plate for circulating the liquid coolant through the cooling channel;
- a housing impeller positioned in the cavity for circulating the liquid metal through the cooling loop;
- and
- a shaft extending through the housing and cold plate and coupling the housing impeller to the channel impeller such that rotation of the channel impeller drives rotation of the housing impeller.
Dependencies are inferred from the claim text.