Back to results
US 2019/0320531 A1Published application
High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTomomi YASUDA
Life of this patent
Estimating the term…
Abstract
A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).
Claims20
A high-frequency module, comprising:
- a substrate, and
- a first electronic component and a second electronic component mounted on a main surface of the substrate,
- wherein the substrate includes a protruding portion projecting from the main surface,
- the first electronic component is mounted on a region of the main surface different from a region in which the protruding portion is provided, and
- the second electronic component is mounted on the protruding portion.
2 more elements
Dependencies are inferred from the claim text.