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US 2019/0320527 A1Published application
Conductor substrate, wiring substrate and method for producing wiring substrate
AssigneeHitachi Chemical Company, Ltd.
InventorsTakeshi MASAKI, Tangyii SIM, Kumpei YAMADA, Tadahiro OGAWA, Takashi KAWAMORI
Life of this patent
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Abstract
Disclosed is a wiring substrate 1 including a stretchable resin layer 3 and a conductor foil or conductor plating film 5 which is provided on the stretchable resin layer 3 and forms a wiring pattern.
Claims22
A conductor substrate comprising:
- a stretchable resin layer;
- and
- a conductor foil provided on the stretchable resin layer.
A conductor substrate comprising:
- a stretchable resin layer;
- and
- a conductor plating film provided on the stretchable resin layer.
Dependencies are inferred from the claim text.