US 2019/0320131 A1Published application

Imaging device

AssigneeNikon Corporation

InventorMasahiro JUEN

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Abstract

An imaging device has a sensor chip and a signal processing chip. The sensor chip includes a pixel array in which a plurality of pixels are arranged in a 2-dimensional matrix and a data output terminal group made up of a plurality of data output terminals which output analog signals of pixels for each pixel column of the pixel array. The signal processing chip includes a data input terminal group electrically coupled to the data output terminal group, a plurality of A/D converters which convert analog signals of pixels received by the data input terminal group into digital signals for each pixel column of the pixel array, and a control unit which controls operation of the plurality of A/D converters.

Claims10

Dependent claims

An imaging device comprising:

a sensor chip in which a plurality of photoelectric converters which convert light into electric charge are arranged;
a first signal processing chip having a first circuit which is configured to convert a first signal generated by electric charge generated by conversion in a first photoelectric converter among the plurality of photoelectric converters into a digital signal and having a first controller which controls the first circuit;
and
a second signal processing chip having a second circuit which is configured to convert a second signal generated by electric charge generated by conversion in a second photoelectric converter among the plurality of photoelectric converters into a digital signal and having a second controller which controls the second circuit, the second photoelectric converter being arranged on a side in a first direction of the first photoelectric converter, wherein
the first controller or the second controller has a timing generator which controls driving of the sensor chip.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/454,122Filed 27 Jun 2019
Priority: JP 2010-18688824 Aug 2010
Published: 17 Oct 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H04N 25/70
Circuitry of solid-state image sensors [SSIS]; Control thereof: sSIS architectures; Circuits associated therewith
H04N 25/00
Circuitry of solid-state image sensors [ssis]
H04N 25/69
Applied to defects: sSIS comprising testing or correcting structures for circuits other than pixel cells
H04N 25/7795
Addressed sensors, e.g. MOS or CMOS sensors: circuitry for generating timing or clock signals

Family

Application13/813,515Continuation · filed 31 Jan 2013
Application14/936,035Continuation · filed 9 Nov 2015
Application15/654,338Continuation · filed 19 Jul 2017
Application16/454,122Continuation
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US 2013/0128086 A1Published application
US 2016/0065876 A1Published application
US 2017/0318251 A1Published application
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US 2019/0320131 A1This patent

From the US filing history. Foreign family members aren’t listed.

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