Conduit structure of electronic device and electronic device including the same

An electronic device, comprising:

• a housing including a first plate, a second plate configured to face in a direction opposite to that of the first plate, and a side member configured to enclose a space between the first plate and the second plate;
• a display exposed through a first region of the first plate;
• an inner structure disposed between the display and the second plate;
• a speaker disposed between the inner structure and the second plate, wherein the speaker communicates sound to outside of the housing through a first opening formed in a second region of the first plate, comprises a surface facing the first plate, and is spaced apart from the inner structure to form a first channel between the surface and the inner structure;
• a microphone disposed between the inner structure and the second plate, wherein the microphone is spaced apart from the speaker;
• a second opening configured to penetrate the inner structure between the microphone and the display;
• a second channel formed between the inner structure and the display;
• and
• a third opening configured to penetrate the inner structure between the first channel and the second channel,
• wherein the microphone is configured to penetrate the first opening to receive sound from the outside of the housing.

A conduit structure of an electronic device, the conduit structure comprising:

• an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure;
• a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure;
• a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure;
• a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure;
• and
• a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.