Laser module with a flattened structure on a mobile device for image measurement

A laser module with flattened structure on a mobile device, comprising:

• a mobile device including a housing with an opening hole, a motherboard installed in the housing, a microprocessor installed on the motherboard, a memory unit installed on the motherboard and electrically connected to the microprocessor, a camera unit installed on a rear surface of the housing and electrically connected to the microprocessor to retrieve an image at a pre-determined angle with a horizontal distance shown on said image, and a touch screen installed on a front surface of the housing and electrically connected to the microprocessor to display the image;
• a laser module with a flattened structure, including a printed circuit board including a top surface, a bottom surface, and a connecting section arranged under said bottom surface for electrical connection;
• a photodiode chip including a detection surface embedded on said printed circuit board for said detection surface to share a common plane surface with said top surface of said printed circuit board and for said photodiode chip to be coupled to said printed circuit board;
• an automatic power control integrated circuit including a first surface and embedded on said printed circuit board for said first surface to share a common plane surface with said top surface of said printed circuit board and with said detection surface of said photodiode chip and for said automatic power control integrated circuit to be coupled to said printed circuit board and said photodiode chip;
• a laser diode chip including a connecting surface and electrically connected to said printed circuit board for said connecting surface to share a common plane surface with said top surface of said printed circuit board, said detection surface of said photodiode chip, and said first surface of said automatic power control integrated circuit and for the laser diode chip to be coupled with said printed circuit board, said photodiode chip, and said automatic power control integrated circuit;
• a case body encapsulating the printed circuit board, the photodiode chip, the automatic power control integrated circuit and the laser diode chip and leaving the connecting section of the printed circuit board uncovered outside said case body, said case body further including a light emitting hole;
• a collimating lens disposed in said case body at a front of said laser diode chip to collimate said first laser beam and form a collimated light;
• and a reflector disposed in said case body at a front of said collimating lens at an angle of 135° to refract said collimated light at 90° to said light emitting hole of the case body,
• whereby the collimated light is emitted by the laser module to the opening hole of the housing of the mobile device;
• the connecting section of the printed circuit board is adhered on the motherboard of the mobile device for the laser module with flattened structure to be operated by the microprocessor;
• and the laser module is arranged at a pre-determined distance from the camera unit and projecting a collimated light parallel with an optic axis retrieved by the camera unit, said optic axis and collimated light respectively adjusted perpendicularly to a horizontal distance on the image for an end of said optic axis and a point of the collimated light both projected to said horizontal distance;
• and
• a camera program installed in the memory unit and operated by the microprocessor to activate the camera unit, record the image and thereby retrieve an image data, said image data including pixel values for further retrieving of a set of pixel values horizontally and a pixel value of a dot within the set of pixel value;
• whereby the microprocessor matches the set of pixel values with the horizontal distance and sets the point of the collimated light as the dot in the image, rendering a reference point for measurement with the pixel value of the dot.

A laser module with a flattened structure, comprising:

• a printed circuit board including a top surface, a bottom surface, and a connecting section arranged under said bottom surface for electrical connection;
• a photodiode chip including a detection surface and embedded on said printed circuit board for said detection surface to share a common plane surface with said top surface of said printed circuit board and for said photodiode chip to be coupled to said printed circuit board;
• an automatic power control integrated circuit including a first surface and embedded on said printed circuit board for said first surface to share a common plane surface with said top surface of said printed circuit board and with said detection surface of said photodiode chip and for said automatic power control integrated circuit to be coupled to said printed circuit board and said photodiode chip;
• a laser diode chip including a connecting surface and electrically connected to said printed circuit board for said connecting surface to share a common plane surface with said top surface of said printed circuit board, said detection surface of said photodiode chip, and said first surface of said automatic power control integrated circuit and for the laser diode chip to be coupled with said printed circuit board, said photodiode chip, and said automatic power control integrated circuit;
• and
• a case body to encapsulate the printed circuit board, the photodiode chip, the automatic power control integrated circuit and the laser diode chip and leave the connecting section of the printed circuit board uncovered outside said case body, said case body including a light emitting hole;
• a collimating lens disposed in said case body at a front of said laser diode chip to collimate said first laser beam and form a collimated light;
• a reflector disposed in said case body at a front of said collimating lens at an angle of 135° to refract said collimated light at 90° to said light emitting hole of the case body.