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AssigneeHuizhou city yuan sheng Technology Co. Ltd.
InventorsYANQING CAI, WEN WANG
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The present invention is a 5.8 GHz planar antenna, including a PCB, wherein the PCB has two layers, one layer is a base material layer, the other layer is a copper foil layer, the copper foil layer and the base material layer are closely adhered, and the size of the base material layer is larger than the size of the copper foil layer; a first microstrip line is disposed on the copper foil layer, and the first microstrip line and the copper foil layer are integrally formed. The present invention further provides a microwave induction module The present invention further provides a process for preparing a microwave induction module. The 5.8 GHz planar antenna and the microwave induction module are optimal in resonant frequency and low in manufacturing cost.
A 5.8 GHz planar antenna, comprising a PCB, the PCB having two layers, one layer being a base material layer and the other layer being a copper foil layer, wherein the copper foil layer and the base material layer are closely adhered, and the size of the base material layer is larger than the size of the copper foil layer;
A process for preparing a microwave induction module, comprising the following steps of:
Dependencies are inferred from the claim text.