Integrated antenna array packaging structures and methods

A method comprising:

• providing an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element;
• providing a plurality of sub-pattern interface packages wherein each sub-pattern interface package of the plurality of sub-pattern interface packages comprises a package carrier and a sub-pattern integrated circuit bonded to bonding pads of the package carrier;
• mating the plurality of sub-pattern interface packages to the mating surface of the antenna array package cover to produce an antenna array package;
• and
• mounting the antenna array package onto a host circuit.

A method comprising:

• providing an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element;
• providing a plurality of sub-pattern interface packages wherein each sub-pattern interface package of the plurality of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit bonded to bonding pads of the package carrier;
• mounting the plurality of sub-pattern interface packages onto a host circuit;
• and
• mating the plurality of sub-pattern interface packages to the mating surface of the antenna array package cover subsequent to mounting the plurality of sub-pattern interface packages onto the host circuit.