Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHan-Chee YEN
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a circuit layer, an antenna structure, a first encapsulant and a reflector. The circuit layer has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The antenna structure is disposed within the circuit layer. The first encapsulant is disposed on the first surface of the circuit layer, the first encapsulant having a surface. The reflector is disposed on the first encapsulant. The third surface of the circuit layer is substantially coplanar with the surface of the first encapsulant.
Claims23
A semiconductor device package, comprising:
- a circuit layer having a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface;
- an antenna structure disposed within the circuit layer;
- a first encapsulant disposed on the first surface of the circuit layer, the first encapsulant having a surface;
- and
- a reflector disposed on the first encapsulant,
- wherein the third surface of the circuit layer is substantially coplanar with the surface of the first encapsulant.
A semiconductor device package, comprising:
- a circuit layer having a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface;
- a reflector disposed within the circuit layer;
- a first encapsulant disposed on the first surface of the circuit layer;
- and
- an antenna structure disposed on the first encapsulant.
A semiconductor device package, comprising:
- a reflector;
- a first encapsulant disposed on the reflector;
- and
- an antenna structure disposed on the first encapsulant,
- wherein a tolerance of a distance between the antenna structure and the reflector is about 2 μm to about 8 μm.
23-28. (canceled)
Dependencies are inferred from the claim text.