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US 2019/0319157 A1Published application
Electronic device comprising electronic chips
AssigneesSTMicroelectronics (Grenoble 2) SAS, Stmicroelectronics Pte Ltd
InventorsRomain COFFY, Laurent HERARD, David GANI
Life of this patent
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Abstract
A carrier wafer has a back face and a front face and a network of electrical connections between the back face and the front face. A first electronic chip is mounted with its bottom face on top of the front face of the carrier wafer. The first electronic chip has a through-opening extending between the bottom face and a face. A second electronic chip is installed in the through-opening and mounted to the front face of the carrier wafer.
Claims7
An electronic device, comprising:
- a carrier wafer having a back face and a front face and provided with a network of electrical connections between the front face and the back face;
- a first electronic chip having a bottom face mounted on top of the front face of the carrier wafer and having a through-opening from a top face to the bottom face;
- and
- a second electronic chip located at least partly in said opening and having a first face mounted on top of the front face of the carrier wafer.
1 more element
Dependencies are inferred from the claim text.