3-dimensional printing process for integrated magnetics
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsLulu PENG, Donald Ray DISNEY, Lawrence Selvaraj SUSAI, Rajesh Sankaranarayanan NAIR
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AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsLulu PENG, Donald Ray DISNEY, Lawrence Selvaraj SUSAI, Rajesh Sankaranarayanan NAIR
Estimating the term…
Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.
A method of forming a device with an integrated magnetic component using three-dimensional printing, the method comprising:
A structure comprising:
Dependencies are inferred from the claim text.