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US 2019/0319082 A1Published application
Chip on film package and display device including the chip on film package
AssigneeSamsung Display Co., Ltd.
InventorsKi-Soo NAM, Gi Young KANG
Life of this patent
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Abstract
A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
Claims20
A chip on film package, comprising:
- a base substrate having an output pad region;
- a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate;
- a plurality of output pad wirings connected to the output pads, respectively;
- and
- a protection layer disposed on the output pad wirings,
- wherein the protection layer is disposed on the output pad wiring disposed between two adjacent output pads, arranged in a first direction, among the output pads.
3 more elements
A display device, comprising:
- a display panel having a pixel region and a pad region, the display panel including:
- a plurality of pixel structures disposed in the pixel region;
- and
- a plurality of pad electrodes disposed in the pad region, wherein the pad electrodes are arranged in a zigzag configuration;
- a chip on film package including:
- a base substrate having an output pad region;
- a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate;
- a plurality of output pad wirings connected to the output pads, respectively;
- and
- a protection layer disposed on the output pad wirings, wherein the output pads overlap the pad electrodes of the display panel, and the protection layer is disposed on the output pad wiring disposed between two adjacent output pads, arranged in a first direction, among the output pads;
- and
- an external device connected to the chip on film package, wherein the external device generates a plurality of signals that are provided to the display panel.
9 more elements
Dependencies are inferred from the claim text.