Method of manufacturing light emitting device

A method of manufacturing a light emitting device, the method comprising:

• providing a wafer that comprises:
• a supporting substrate, and
• a plurality of light emitting structures arranged in a two-dimensional array on a first principal surface of the supporting substrate along a first direction and a second direction, each of the plurality of light emitting structures comprising a first semiconductor layer of a first conductivity type, which includes a first region and a second region, and a second semiconductor layer of a second conductivity type, which covers the second region of the first semiconductor layer, wherein the plurality of light emitting structures includes a first light emitting structure and a second light emitting structure;
• forming a recess in the first principal surface of the supporting substrate between the first light emitting structure and the second light emitting structure;
• forming a resin layer in the recess;
• and
• removing the supporting substrate so as to expose the first semiconductor layer.