Semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorGang Zhang
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a peripheral circuit region on a first substrate, and including at least one circuit device, a memory cell region on a second substrate, on the first substrate, and including memory cells, and a through wiring region including a conductive region that passes through the memory cells and is on the second substrate, and a through contact plug that passes through the conductive region and the second substrate and is configured to electrically connect the memory cell region to the at least one circuit device.
Claims24
A semiconductor device, comprising:
- a peripheral circuit region on a first substrate, and comprising at least one circuit device;
- a memory cell region on a second substrate that is on the first substrate, and comprising memory cells;
- and
- a through wiring region comprising a conductive region that passes through the memory cells and is on the second substrate, and a through contact plug that passes through the conductive region and the second substrate and is configured to electrically connect the memory cell region to the at least one circuit device.
(canceled)
-15. (canceled)
A semiconductor device, comprising:
- a peripheral circuit region on a first substrate, and comprising at least one circuit device;
- a memory cell region on a second substrate that is on the first substrate, and comprising gate electrodes spaced apart from each other and stacked perpendicularly to an upper surface of the second substrate, and channels passing through the gate electrodes that extend in a first direction that is perpendicular to the upper surface of the second substrate;
- and
- a through wiring region comprising a conductive region passing through the gate electrodes and connected to the second substrate, and a through contact plug passing through the conductive region and through the second substrate and extending in the first direction.
(canceled)
A semiconductor device, comprising:
- a first region on a first substrate, and comprising at least one first device;
- a second region on a second substrate that is on the first substrate, and comprising second devices on the second substrate;
- and
- a through wiring region comprising a through wiring structure passing through the second substrate and electrically connecting the at least one first device to the second devices and a conductive region surrounding the through wiring structure.
(canceled)
Dependencies are inferred from the claim text.