Led package structure

An LED package structure, comprising:

• a substrate having a die bond area;
• and
• a light-emitting array disposed in the die bond area, wherein the light-emitting array includes a plurality of non-secondarily excited first light-emitting units for generating a first light beam and a plurality of non-secondarily excited second light-emitting units for generating a second light beam;
• wherein each of the first light-emitting units includes a first light-emitting chip and a first wavelength conversion layer covering the first light-emitting chip, and each of the second light-emitting units includes a second light-emitting chip and a second wavelength conversion layer covering the second light-emitting chip;
• the first light beam includes a first emission light generated by exciting the first wavelength conversion layer, the second light beam includes a second emission light generated by exciting the second wavelength conversion layer, and the difference between the peak wavelength of the first emission light and the peak wavelength of the second emission light is at least 30 nm.