Stacked semiconductor packages, methods of fabricating the same, and/or systems employing the same

An apparatus, comprising:

• a lower semiconductor package comprising:
• a first package substrate;
• a first semiconductor chip on the first package substrate, the first semiconductor chip having a top surface which is exposed;
• a chip bump between the first package substrate and the first semiconductor chip, the chip bump electrically connected to the first package substrate and the first semiconductor chip;
• and
• a molding compound covering the chip bump and at least portion of the first semiconductor chip, a top surface of the molding compound being coplanar with the top surface of the first semiconductor chip;
• an upper semiconductor package stacked on the lower semiconductor package, the upper semiconductor package comprising a second package substrate and a second semiconductor chip;
• and
• an inter-package connector extending from a top surface of the first package substrate to a bottom surface of the second package substrate, the inter-package connector electrically connected to the first package substrate and the second package substrate.

An apparatus, comprising:

• a first package substrate including a lower land;
• a first semiconductor chip on the first package substrate, the first semiconductor chip having a top surface which is exposed;
• a chip bump between the first semiconductor chip and the first package substrate;
• a molding compound covering the chip bump and at least a portion of the first semiconductor chip, a top surface of the molding compound being coplanar with the top surface of the first semiconductor chip;
• a second package substrate including an upper land;
• and
• an inter-package connector extending from the lower lard of the first package substrate to the upper land of the second package substrate;
• wherein the molding compound includes a via hole accommodating at least a portion of the inter-package connector, and an air gap is formed between a sidewall of the via hole and the inter-package connector.