Semiconductor packaging structure and method of forming the same

A method of forming a semiconductor packaging structure, the method comprising:

• forming a plurality of semiconductor packages, each semiconductor package comprising a semiconductor die and a mold encapsulation structure covering at least a portion of the semiconductor die;
• arranging the plurality of semiconductor packages to form a vertical stacked arrangement with a mold portion comprising a plurality of mold encapsulation structures, the mold portion extending from a first side of the vertical stacked arrangement to a second side of the vertical stacked arrangement opposite the first side;
• forming a first via on the mold portion at the first side of the vertical stacked arrangement after the vertical stacked arrangement is formed;
• forming a second via on the mold portion at the second side of the vertical stacked arrangement after forming the first via;
• and
• forming an electrically conductive filled via extending through the mold portion from the first side of the vertical stacked arrangement to the second side of the vertical stacked arrangement by depositing a suitable electrically conductive material in the first via and in the second via;
• wherein a diameter of the electrically conductive filled via at the first side of the vertical stacked arrangement is greater than a diameter of the electrically conductive filled via along an intervening plane of the vertical stacked arrangement, the intervening plane between the first side of the vertical stacked arrangement and the second side of the vertical stacked arrangement;
• and
• wherein a diameter of the electrically conductive filled via at the second side of the vertical stacked arrangement is greater than the diameter of the electrically conductive filled via along the intervening plane of the vertical stacked arrangement.