Device, semiconductor package and method of manufacturing semiconductor package

A semiconductor package, comprising:

• an encapsulated semiconductor device comprising a semiconductor device encapsulated by an encapsulating material;
• and
• a redistribution structure extended over the encapsulated semiconductor device and electrically connected to the semiconductor device, wherein the redistribution structure comprises:
• a dielectric layer;
• a pad pattern disposed on the dielectric layer, wherein pad pattern comprises at least one pad portion embedded in the dielectric layer, and a lower surface of the pad pattern is substantially coplanar with a lower surface of the dielectric layer away from the encapsulated semiconductor device;
• and
• a plurality of dielectric plugs extending through the pad pattern and surrounding the at least one pad portion.

A method of manufacturing a semiconductor package, comprising:

• forming a redistribution structure on a carrier, wherein forming the redistribution structure on the carrier comprises:
• forming a first dielectric layer on the carrier, wherein the first dielectric layer comprises a pad opening;
• forming a pad pattern on the first dielectric layer, wherein the pad pattern extends into the pad opening and comprises a plurality of holes surrounding the pad opening;
• and
• forming a second dielectric layer on the pad pattern, wherein the second dielectric layer fills the plurality of holes;
• forming an encapsulated semiconductor device on the redistribution structure;
• and
• removing the carrier to reveal a lower surface of the pad pattern.