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US 2019/0318999 A1Published application
Semiconductor device
AssigneeToyota Jidosha Kabushiki Kaisha
InventorTakanori KAWASHIMA
Life of this patent
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Abstract
A semiconductor device may include at least one semiconductor chip, an encapsulant encapsulating the at least one semiconductor chip, a first power terminal connected to the at least one semiconductor chip within the encapsulant, and a second power terminal electrically connected to the first power terminal via the at least one semiconductor chip within the encapsulant. The first power terminal and the second power terminal each may have a plate shape and may be at least partly opposed to each other within the encapsulant
Claims14
A semiconductor device comprising:
- at least one semiconductor chip;
- encapsulant encapsulating the at least one semiconductor chip;
- a first power terminal connected to the at least one semiconductor chip within the encapsulant and exposed to outside of the encapsulant;
- and
- a second power terminal electrically connected to the first power terminal via the at least one semiconductor chip within the encapsulant and exposed to the outside of the encapsulant,
- wherein
- the first power terminal and the second power terminal each have a plate shape and are at least partly opposed to each other within the encapsulant.
4 more elements
Dependencies are inferred from the claim text.