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US 2019/0318996 A1Published application
Molding Compound and Semiconductor Package with a Molding Compound
AssigneeInfineon Technologies AG
InventorsAnton Mauder, Oliver Hellmund, Peter Irsigler, Hanno Melzner, Stefan Miethaner, Sebastian Schmidt, Hans-Joachim Schulze
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Abstract
A molding compound and a semiconductor arrangement with a molding compound are disclosed. The molding compound includes a matrix and a filler including filler particles. The filler particles each include a core with an electrically conducting or a semiconducting material and an electrically insulating cover.
Claims18
A molding compound, comprising:
- a matrix;
- and
- a filler comprising filler particles,
- wherein the filler particles each comprise a core comprising a semiconducting material and an electrically insulating cover.
1 more element
Dependencies are inferred from the claim text.