Semiconductor package using cavity substrate and manufacturing methods

A semiconductor package, comprising:

• a cavity substrate including:
• a redistribution structure comprising a redistribution structure upper surface having a plurality of pads, a redistribution structure lower surface opposite the redistribution structure upper surface, and one or more redistribution structure sidewalls adjacent the redistribution structure upper surface and the redistribution structure lower surface;
• and
• a cavity layer on the redistribution structure upper surface, the cavity layer comprising a cavity layer upper surface, a cavity layer lower surface opposite the cavity layer upper surface, one or more cavity layer sidewalls adjacent the cavity layer upper surface and the cavity layer lower surface, a cavity in the cavity layer upper surface that exposes one or more pads from the plurality of pads, and a trench that passes through a cavity layer sidewall from the one or more cavity layer sidewalls;
• a semiconductor die in the cavity of the cavity layer, the semiconductor die comprising a semiconductor die first surface, a semiconductor die second surface opposite the semiconductor die first surface, one or more semiconductor die sidewalls adjacent the semiconductor die first surface and the semiconductor die second surface, and a plurality of conductive structures along the semiconductor die second surface that are operatively coupled to integrated circuitry of the semiconductor die;
• and
• an encapsulant that encapsulates the semiconductor die in the cavity of the cavity layer and fills the trench.

A method of fabricating a plurality of semiconductor packages, the method comprising:

• placing a plurality of semiconductor dies in a plurality of cavity substrates;
• attaching attachment structures of each semiconductor die to a plurality of pads of a redistribution structure that are exposed by a cavity of each cavity substrate;
• and
• encapsulating, via an encapsulating material, the plurality of semiconductor dies in the plurality of cavity substrates.