Back to results
US 2019/0318993 A1Published application
Enabling long interconnect bridges
AssigneeIntel Corporation
InventorsRavindranath V. Mahajan, Zhiguo Qian, Henning Braunisch, Kemal Aygun, Sujit Sharan
Life of this patent
Estimating the term…
Abstract
A device and method of utilizing a repeater circuit to extend the viable length of an interconnect bridge. Integrated circuit packages using a repeater circuit in a repeater die, embedded in a substrate, and included in an interconnect bridge are show. Methods of connecting semiconductor dies using interconnect bridges coupled with repeater circuits are shown.
Claims26
-24. (canceled)
A semiconductor device, comprising:
- a substrate;
- a first semiconductor die attached to the substrate;
- a second semiconductor die attached to the substrate;
- an interconnect bridge electrically coupled to the first semiconductor die and the second semiconductor die;
- and
- a repeater circuit electrically coupled to the interconnect bridge along a communication path between the first semiconductor die and the second semiconductor die.
3 more elements
A semiconductor device comprising:
- a substrate;
- a first semiconductor die attached to the substrate;
- a second semiconductor die attached to the substrate;
- a silicon interconnect bridge at least partially embedded in the substrate, the silicon interconnect bridge electrically coupled to the first semiconductor die and the second semiconductor die;
- and
- a repeater circuit electrically coupled to the silicon interconnect bridge along a communication path between the first semiconductor die and the second semiconductor die.
3 more elements
A method comprising:
- embedding, at least partially, a lithographically created interconnect bridge in a substrate;
- attaching a first semiconductor die to the substrate, including electrically coupling the first semiconductor to a first end of the interconnect bridge;
- attaching a second semiconductor die to the substrate, including electrically coupling the second semiconductor die to the interconnect bridge;
- and
- coupling, electrically, a repeater circuit to the interconnect bridge along a communication path between the first semiconductor die and the second semiconductor die.
2 more elements
Dependencies are inferred from the claim text.