Output Driver Circuit Configurable with Via Layer to Support Multiple Standards
AssigneeIntel Corporation
InventorsEah Loon Alan Chuah, Ting Ting Au
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsEah Loon Alan Chuah, Ting Ting Au
Estimating the term…
An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites by filling via openings and/or using jumpers may implement a voltage-mode driver circuit with a first via configuration, a current-mode driver circuit with a second via configuration, and/or a differential driver circuit with a third configuration.
An integrated circuit device comprising:
A method of manufacturing an integrated circuit comprising:
A configurable circuit, comprising:
Dependencies are inferred from the claim text.