Semiconductor device

A semiconductor device comprising:

• a semiconductor chip including a first front surface, a first back surface on an opposite side from the first front surface, and a plurality of electrodes arrayed on the first front surface;
• and
• a wiring substrate including a first main surface on which the semiconductor chip is mounted, a second main surface on an opposite side from the first main surface, a plurality of pads arrayed on the first main surface, and a plurality of wiring layers provided between the first main surface and the second main surface,
• wherein the plurality of electrodes of the semiconductor chip and the plurality of pads of the wiring substrate face each other and are electrically connected through conductive members,
• wherein the wiring substrate includes a pad forming layer in which the plurality of pads is formed and a first wiring layer which is located at a position closer to the pad forming layer than the other wiring layers,
• wherein the plurality of pads includes a first pad and a second pad,
• wherein the first wiring layer includes a first via land, a second via land, a first wiring and a second wiring,
• wherein the first via land is arranged at a position overlapping with the first pad in plan view and electrically connected to the first pad through a first via,
• wherein the second via land is arranged at a position overlapping with the second pad in plan view and electrically connected to the second pad through a second via,
• wherein the first wiring is connected to the first via land and extends in a first direction and the second wiring is connected to the second via land and extends adjacent to the first wiring in the first direction,
• wherein, in a second direction intersecting with the first direction, a width of the first via land is larger than a width of the first wiring, and
• wherein the second wiring is adjacent to the first via land and overlaps with the first pad in plan view.