Semiconductor package structure and method for manufacturing the same

A semiconductor package structure comprising:

• a first package comprising a bonding region and a periphery region surrounding the bonding region;
• a plurality of first insulating structures disposed in the bonding region of the first package;
• a plurality of second insulating structures disposed in the periphery region of the first package;
• a second package disposed over the first package and the plurality of first insulating structures in the bonding region;
• and
• a plurality of connectors disposed between the first package and the second package in the bonding region, and electrically coupling the first package and the second package,
• wherein the plurality of first insulating structures and the plurality of second insulating structures penetrate the first package, and the plurality of first insulating structures are spaced apart from the plurality of connectors.

A method for manufacturing a semiconductor package structure, comprising:

• providing a first package comprising a first surface, a second surface opposite to the first surface, and at least a first through-hole penetrating the first package from the first surface to the second surface;
• bonding the first surface of the first package to a second package by a plurality of connectors disposed between the first package and the second package;
• and
• providing at least a cleaning agent to the second surface of the first package;
• wherein the cleaning agent is injected into a space between the first package, the second package and each of the plurality of connectors through the first through-hole.