Package structure for electronic assemblies

A package structure for electronic assemblies comprising:

• a porous insulation substrate penetrated with a plurality of through holes, and each of the plurality of through holes has a diameter which is larger than 0 and less than 1 um and each of the plurality of through holes is arranged in the porous insulation substrate at a same height;
• a conductive material filling the plurality of through holes;
• a first electronic assembly arranged under the porous insulation substrate and electrically connected to the conductive material in the plurality of through holes through at least one first conductive bump;
• and
• a second electronic assembly arranged over the porous insulation substrate and electrically connected to the conductive material in the plurality of through holes through at least one second conductive bump to electrically connect to the first electronic assembly,
• wherein the at least one first conductive bump further comprises a plurality of first conductive bumps, and each of the plurality of first conductive bumps is electrically connected to the conductive material in several hundreds of the plurality of through holes, and
• wherein the at least one second conductive bump further comprises a plurality of second conductive bumps, and each of the plurality of second conductive bumps is electrically connected to the conductive material in several hundreds of the plurality of through holes
• wherein each of the plurality of first conductive bumps and each of the plurality of second conductive bumps respectively cover at least two of the plurality of through holes.