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US 2019/0318980 A1Published application
Method of manufacturing electronic device
AssigneeFujitsu Limited
InventorsShinichi Hirose, Daiyu Kondo
Life of this patent
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Abstract
The disclosed method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.
Claims5
An electronic device comprising:
- a component;
- a resin film fixed to the component;
- and
- a plurality of carbon nanotubes whose end portions penetrate the resin film and are in contact with the component, wherein
- the resin film is provided with a climb portion formed by making the resin film climb up a side surface of the carbon nanotube.
2 more elements
A heat dissipating sheet comprising:
- a resin film;
- and
- a plurality of carbon nanotubes whose end portions penetrate the resin film, wherein
- the resin film is provided with a climb portion formed by making the resin film climb up a side surface of the carbon nanotube.
1 more element
Dependencies are inferred from the claim text.