Chip scale package (csp) including shim die
AssigneeXilinx, Inc.
InventorsHong Shi, Suresh Ramalingam, Siow Chek Tan, Gamal Refai-Ahmed
Life of this patent
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Abstract
Examples of the present disclosure provide example Chip Scale Packages (CSPs). In some examples, a structure includes a first integrated circuit die, a shim die that does not include active circuitry thereon, an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die, and a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant. The redistribution structure includes one or more metal layers electrically connected to the first integrated circuit die.
Claims22
A structure comprising:
- a first integrated circuit die;
- a shim die being a dummy die having no active or passive circuitry thereon;
- an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die;
- and
- a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant, wherein the redistribution structure includes one or more metal layers electrically connected to the first integrated circuit die.
(canceled)
A structure, comprising:
- a first integrated circuit die;
- a shim die;
- an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die;
- a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant, wherein the redistribution structure includes one or more metal layers electrically connected to the first integrated circuit die;
- a number of input/output (IO) bumps of the conductive bumps aligned in a direction is equal to a dimension divided by a linear pitch of the 10 bumps along the direction;
- and
- the dimension is a sum of:
- (i) a dimension of the first integrated circuit die along the direction,
- (ii) a dimension of the shim die along the direction,
- (iii) a dimension of the encapsulant disposed along the direction and between the shim die and the first integrated circuit die,
- (iv) a dimension of the encapsulant extending along the direction and from the shim die on a side opposite from the first integrated circuit die, and
- (v) a dimension of the encapsulant extending along the direction and from the first integrated circuit die on a side opposite from the shim die.
(canceled)
A structure comprising:
- a chip scale package (CSP) comprising:
- an integrated circuit die;
- a shim die being a dummy die having no active or passive circuitry thereon;
- an encapsulant at least laterally encapsulating the integrated circuit die and the shim die;
- and
- a redistribution structure on the integrated circuit die, the shim die, and the encapsulant, the redistribution structure including one or more metal layers electrically connected to the integrated circuit die;
- conductive bumps attached to the redistribution structure of the CSP, the conductive bumps being electrically connected to the one or more metal layers;
- and
- a package substrate, the conductive bumps being attached to the package substrate.
Dependencies are inferred from the claim text.