Circuit module and method of manufacturing the same

A method for manufacturing a circuit module, comprising:

• a step of preparing a first substrate including a first principal surface;
• a step of preparing a first module, the first module including a conductive material portion, and a device capable of producing heat and mounted on the conductive material portion;
• a step of mounting the first module on the first principal surface;
• a step of forming a sealing resin portion on the first principal surface in such a manner that the sealing resin portion covers the first module;
• a step of exposing a cross section of the conductive material portion on a side of the sealing resin portion while a portion of the sealing resin portion is removed;
• and
• a step of forming a conductive material film in such a manner that the conductive material film covers the side of the sealing resin portion, and thus obtaining a structure having the exposed cross section of the conductive material portion connected to the conductive material film on the side of the sealing resin portion.