Semiconductor device

A semiconductor device comprising:

• a semiconductor chip;
• a case surrounding the semiconductor chip;
• a case electrode attached to an upper face of the case;
• a wire connected to the semiconductor chip and the case electrode;
• a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
• and
• a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
• wherein a recess is formed on the upper face of the case, and
• the second holding portion is disposed inside the recess.

A semiconductor device comprising:

• a semiconductor chip;
• a case surrounding the semiconductor chip;
• a case electrode attached to an upper face of the case;
• and
• a wire connected to the semiconductor chip and the case electrode,
• wherein a recess is formed on a side face of the case electrode, and
• the case electrode is fixed to the case with case resin filled in the recess.

A semiconductor device comprising:

• a semiconductor chip;
• a case surrounding the semiconductor chip;
• a case electrode attached to an upper face of the case;
• a wire connected to the semiconductor chip and the case electrode;
• a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
• and
• a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
• wherein the second holding portion is tapered along the wire.

A semiconductor device comprising:

• a semiconductor chip;
• a case surrounding the semiconductor chip;
• a case electrode attached to an upper face of the case;
• a wire connected to the semiconductor chip and the case electrode;
• a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
• and
• a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
• wherein the second holding portion is adhesive.