Device for transferring and integrating micro-devices and method of transfer

A method for transferring micro-devices, comprises:

• providing a transfer device, wherein the transfer device comprises a first substrate and at least one transfer substrate located on the first substrate, a least one buffering member is located between the first substrate and the at least one transfer substrate;
• forming a plurality of micro-devices on the at least one transfer substrate;
• providing a receiving substrate, aligning the receiving substrate to the at least one transfer substrate;
• pressuring the receiving substrate or the transfer device to bond the micro-devices to the receiving substrate, wherein the buffering member provides a buffering for the micro-devices when pressuring the receiving substrate or the transfer device;
• and
• removing the transfer substrate.

A method for transferring micro-devices, comprises:

• providing a transfer device, wherein the transfer device comprises a first substrate, a plurality of transfer substrate, a plurality of platforms and a plurality of buffering members;
• the first substrate has a plurality of wells recessed from the first substrate;
• each of the wells accommodates with one of the platforms;
• each of the buffering members is located between one of the wells and one of the platforms accommodated in the well;
• each of the transfer substrates is supported by one of the platforms;
• at least one ultraviolet light source is located on a bottom surface of each of the wells;
• forming a plurality of micro-devices on the transfer substrate, the micro-devices are bonded to the transfer substrates by a plurality of adhesive layers;
• providing a receiving substrate, aligning the receiving substrate to the transfer substrates;
• pressuring the receiving substrate or the transfer device to bond the micro-devices to the receiving substrate, wherein the buffering member provides a buffering space for the micro-devices when pressuring the receiving substrate or the transfer device;
• turning on the at least one ultraviolet light source, wherein the adhesive layer are irradiated by ultraviolet lights emitted from the at least one ultraviolet light source;
• and
• removing the transfer substrate.