Shape metric based scoring of wafer locations

A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for shape metric based sorting of wafer locations, wherein the computer-implemented method comprises:

• selecting shape based grouping rules for at least two locations on a wafer, wherein for one of the locations on the wafer, selecting the shape based grouping rule comprises:
• determining distances between geometric primitives in a field of view centered on the one location by modifying distances between the geometric primitives in a design for the wafer with metrology data for the one location on the wafer;
• determining metrical complexity scores for shape based grouping rules associated with the geometric primitives in the field of view based on the determined distances between the geometric primitives;
• and
• selecting one of the shape based grouping rules for the one location based on the metrical complexity scores;
• and
• sorting the at least two locations on the wafer based on the shape based grouping rules selected for the at least two locations.

A computer-implemented method for shape metric based sorting of wafer locations, comprising:

• selecting shape based grouping rules for at least two locations on a wafer, wherein for one of the locations on the wafer, selecting the shape based grouping rule comprises:
• determining distances between geometric primitives in a field of view centered on the one location by modifying distances between the geometric primitives in a design for the wafer with etrology data for the one location on the wafer;
• determining metrical complexity scores for shape based grouping rules associated with the geometric primitives in the field of view based on the determined distances between the geometric primitives;
• and
• selecting one of the shape based grouping rules for the one location based on the metrical complexity scores;
• and
• sorting the at least two locations on the wafer based on the shape based grouping rules selected for the at least two locations, wherein selecting the shape based grouping rules and the sorting steps are performed by one or more computer subsystems.