Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems

An electronic device manufacturing system, comprising:

• a transfer chamber;
• a process chamber coupled to the transfer chamber, the transfer chamber configured to transfer one or more substrates to and from the process chamber, the process chamber configured to process the one or more substrates therein;
• a loadlock coupled to the transfer chamber, the transfer chamber configured to transfer the one or more substrates to and from the loadlock;
• and
• a motion controller configured to:
• cause direct contact within the process chamber between respective surfaces of a process delivery apparatus and a substrate support or one of the one or more substrates received on the substrate support;
• and
• perform gap calibration based on the direct contact.

A method of calibrating a gap between component surfaces in a process chamber or a loadlock of an electronic device manufacturing system, the method comprising:

• actuating one or more actuators in the process chamber or the loadlock to cause direct contact between the component surfaces without taking the process chamber or the loadlock offline;
• and
• responding to detected direct contact between the component surfaces;
• wherein the actuating and the responding are performed while maintaining at least one of a) the process chamber or loadlock at a process temperature or b) the process chamber or loadlock at a process pressure.