Manufacturing method of semiconductor device and semiconductor device

A manufacturing method of a semiconductor device, comprising:

• (a) preparing a lead frame having:
• a first tie bar extending in a first direction in plan view so as to couple a plurality of first leads to one another;
• a second tie bar extending in the first direction in plan view so as to couple a plurality of second leads to one another;
• a coupling portion coupled to the first tie bar and the second tie bar;
• a first chip mounting portion arranged between the first tie bar and the second tie bar in plan view;
• and a second chip mounting portion arranged between the first chip mounting portion and the second tie bar in plan view;
• (b) after the (a), mounting a first semiconductor chip on the first chip mounting portion and mounting a second semiconductor chip on the second chip mounting portion;
• and
• (c) after the (b), sandwiching the lead frame, on which the first semiconductor chip and the second semiconductor chip are mounted, between a first mold and a second mold, and then supplying resin into a cavity defined by the first mold and the second mold via a gate portion that is formed on the first mold and is provided at a position overlapping the coupling portion of the lead frame to form an encapsulation body that encapsulates a portion of each of the first leads, a portion of each of the second leads, the first chip mounting portion, the second chip mounting portion, the first semiconductor chip, and the second semiconductor chip,
• wherein the plurality of first leads each include an inner lead portion covered by the encapsulation body and an outer lead portion exposed to the outside of the encapsulation body,
• the plurality of first leads include:
• a third lead having the inner lead portion located between the first tie bar and the first chip mounting portion in a second direction orthogonal to the first direction;
• and a fourth lead having the inner lead portion not located between the first tie bar and the first chip mounting portion,
• in plan view, the first chip mounting portion includes:
• a first side extending along the first tie bar;
• a second side opposite to the first side;
• a third side extending along the second direction;
• and a fourth side opposite to the third side and extending along the second direction,
• in plan view, the first side of the first chip mounting portion is located between the first tie bar and the second side of the first chip mounting portion,
• a distance in the second direction from the first side of the first chip mounting portion to a first virtual line extending in the first direction and passing through a midpoint of the first tie bar and the second tie bar in the second direction is greater than a length of the inner lead portion of the third lead in the second direction,
• a length of the inner lead portion of the fourth lead in the second direction is greater than the length of the inner lead portion of the third lead in the second direction,
• in the (c), when the lead frame is sandwiched between the first mold and the second mold, the gate portion of the first mold is located closer to the first tie bar than to the second tie bar in plan view,
• in the (c), when the lead frame is sandwiched between the first mold and the second mold, a portion of the inner lead portion of the fourth lead is located between the first chip mounting portion and the gate portion in plan view,
• in the (c), when the lead frame is sandwiched between the first mold and the second mold, a spacing between the portion of the inner lead portion of the fourth lead and the gate portion in the first direction is smaller than a spacing between the portion of the inner lead portion of the fourth lead and the first chip mounting portion in the first direction, and
• in the (c), the resin is supplied into the cavity with the lead frame sandwiched between the first mold and the second mold such that the portion of the inner lead portion of the fourth lead is located on a second virtual line passing through the gate portion and extending in the first direction in plan view.