Processing apparatus and method for controlling processing apparatus

A processing apparatus including:

• a processing container, in which a substrate is processed;
• an electrode that is disposed on a ceiling portion of the processing container or inside the processing container, a mounting stage for mounting the substrate functioning as the electrode;
• an electric power supply unit configured to apply high frequency power to the electrode;
• a coil disposed on the ceiling portion or an opposite surface of the mounting stage opposite to a processing space surface of the mounting stage on a side of a processing space, one end of the coil being connected to the electrode and another end of the coil being connected to a ground;
• and
• an adjusting mechanism configured to control magnetic field strength of a magnetic field generated by the coil and passes through the coil.

A method for controlling a processing apparatus that processes an substrate inside a processing container including

• a first electrode disposed inside the processing container, the first electrode being configured to mount the substrate on it,
• a second electrode disposed so as to face the first electrode,
• an electric power supply unit configured to apply high frequency power to the first electrode or the second electrode,
• a coil disposed on a surface opposite to the surface to which the first electrode or the second electrode faces and on a surface of any one of the first electrode and the second electrode, one end of the coil being connected to the any one of the the first electrode and the second electrode, another end of the coil being connected to ground, and
• an adjusting mechanism configured to control a magnetic field strength of a magnetic field that is from the coil and passes through the coil, the method comprising:
• controlling at least one of a position, an angle, a length, and an impedance of each of the plurality of coils using the adjusting mechanism.