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US 2019/0318910 A1Published application
Substrate processing apparatus and substrate processing method
AssigneeASM IP Holding B.V.
InventorYukihiro MORI
Life of this patent
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Abstract
Examples of a substrate processing apparatus include a stage, an outer peripheral ring that surrounds the stage while provided with a gap between a side surface of the stage and the outer peripheral ring, a gas supply unit configured to supply gas from a lower side of the gap to an upper side of the gap, and an upper electrode provided above the stage.
Claims20
A substrate processing apparatus comprising:
- a stage;
- an outer peripheral ring that surrounds the stage while provided with a gap between a side surface of the stage and the outer peripheral ring;
- a gas supplier that supplies gas from a lower side of the gap to an upper side of the gap;
- and
- an upper electrode provided above the stage.
2 more elements
A substrate processing method comprising:
- placing, on a stage, only a center portion of a substrate that has the center portion and an enclosing portion for enclosing the center portion;
- and
- applying high frequency power to an upper electrode above the stage while supplying reaction gas from a lower side of the enclosing portion to surroundings of the enclosing portion, thereby generating plasma on a back surface side of the enclosing portion and on a side surface side of the enclosing portion to perform plasma processing on the enclosing portion.
Dependencies are inferred from the claim text.