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US 2019/0318877 A1Published application
Leadless Stack Comprising Multiple Components
AssigneeKemet Electronics Corporation
InventorsJohn E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
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Abstract
An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements
Claims11
1-55. (canceled)
A method for forming an electronic element comprising:
- forming an MLCC comprising a first capacitor external termination and a second capacitor external termination;
- forming an electronic element comprising a first element external termination and a second element external termination;
- and
- arranging said MLCC and said electronic element in a stack with a TLPS bond between said first capacitor external termination and said first element external termination.
1 more element
Dependencies are inferred from the claim text.