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US 2019/0317408 A1Published application
Method and apparatus for processing substrate
AssigneeSemes Co., Ltd.
InventorsHEEJAE GOO, KYO SANG YOON, BYOUNGDOO CHOI, SANGMO YANG
Life of this patent
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Abstract
The inventive concept relates to a substrate processing method and apparatus for providing a plurality of gas layers and contamination prevention liquid layers in a nozzle after the nozzle dispenses photoresist onto a substrate, thereby preventing photoresist in the nozzle from making contact with air and thus preventing the photoresist in the nozzle from being solidified by a reaction of the photoresist with air.
Claims18
A method for processing a substrate, the method comprising:
- a process of processing the substrate by dispensing a processing liquid onto the substrate through a nozzle having a discharge passage formed therein;
- and
- a storage process of storing the nozzle, with the processing liquid sucked back into the discharge passage,
- wherein in the storage process, the nozzle is stored, with a first gas layer, a first contamination prevention liquid layer, a second gas layer, and a second contamination prevention liquid layer sequentially formed in the discharge passage, and
- wherein the first gas layer is located adjacent to the processing liquid.
2 more elements
A method for processing a substrate, the method comprising:
- a step of processing the substrate by dispensing a processing liquid onto the substrate through a nozzle;
- a first gas layer forming step of forming a first gas layer in an end of a discharge passage of the nozzle by sucking back the processing liquid in the discharge passage of the nozzle;
- a first liquid layer forming step of forming a first contamination prevention liquid layer in the discharge passage of the nozzle by pulling a first contamination prevention liquid into the discharge passage of the nozzle from the outside by applying a suction force to the discharge passage of the nozzle, after the first gas layer forming step;
- a second gas layer forming step of forming a second gas layer in the discharge passage of the nozzle by applying a suction force to the passage of the nozzle, after the first liquid layer forming step;
- and
- a second liquid layer forming step of forming a second contamination prevention liquid layer in the discharge passage of the nozzle by pulling a second contamination prevention liquid into the discharge passage of the nozzle from the outside by applying a suction force to the discharge passage of the nozzle, after the second gas layer forming step.
3 more elements
An apparatus for processing a substrate, the apparatus comprising:
- a cup having a processing space therein, in which the substrate is processed;
- a support unit configured to support the substrate in the processing space;
- a liquid dispensing unit including a nozzle configured to dispense a processing liquid onto the substrate supported on the support unit;
- a home port configured to store the nozzle while the nozzle does not dispense the processing liquid onto the substrate;
- and
- a controller configured to control the liquid dispensing unit,
- wherein the liquid dispensing unit includes:
- the nozzle having a discharge passage formed therein;
- a liquid supply tube configured to supply the processing liquid into the nozzle;
- and
- a suck-back valve installed on the liquid supply tube and configured to apply a suction force to the discharge passage,
- wherein the controller controls the suck-back valve to apply the suction force to the discharge passage of the nozzle to sequentially form a first gas layer, a first contamination prevention liquid layer, a second gas layer, and a second contamination prevention liquid layer in the nozzle while the nozzle is stored in the home port, and
- wherein the first gas layer is located adjacent to the processing liquid.
10 more elements
Dependencies are inferred from the claim text.