Electronic module including an ambient light sensor stacked over a proximity sensor
AssigneesSTMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SAS
InventorsWilliam HALLIDAY, Eric SAUGIER, Roy DUFFY
Life of this patent
Estimating the term…
Abstract
An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.
Claims24
An electronic module, comprising:
- an ambient light sensor comprising an ambient light photodetector;
- and
- a proximity sensor comprising an infrared photoemitter configured to emit infrared photons, a reference infrared photodetector configured to directly receive infrared photons emitted by the infrared photoemitter and another infrared photodetector configured to indirectly receive infrared photons emitted by the infrared photoemitter and reflected from an object;
- wherein the ambient light sensor is arranged in a stack over the proximity sensor at a position which allows infrared photons transmitted by the infrared photoemitter to be directly received by the reference infrared photodetector.
An electronic module, comprising:
- a support substrate having a top surface;
- a first integrated circuit die mounted to the top surface of the support substrate, the first integrated circuit die including an infrared photoemitter;
- a second integrated circuit die mounted to the top surface of the support substrate, the second integrated circuit die including a reference infrared photodetector and another infrared photodetector;
- a third integrated circuit die including an ambient light sensing photodetector;
- wherein the third integrated circuit die is mounted in a stacked arrangement over the reference infrared photodetector of the second integrated circuit die to:
- a) permit infrared photons emitted from the infrared photoemitter to directly reach the reference infrared photodetector and b) block ambient light from reaching the reference infrared photodetector.
Dependencies are inferred from the claim text.