Film-Forming Apparatus and Film-Forming Method

A film-forming apparatus comprising:

• a process container;
• a mounting stand disposed in the process container;
• a precursor gas supply pipe configured to communicate with the process container;
• an exhaust pipe configured to communicate with the process container;
• a first heater configured to heat the process container;
• a second heater configured to heat the mounting stand;
• and
• a controller connected to the first heater and the second heater, wherein the controller is configured to:
• in a first period, set the second heater to a temperature T1 at which no film is formed on a substrate disposed on the mounting stand, without supplying a precursor gas into the process container, in a state in which the substrate is disposed on the mounting stand;
• in a second period after the first period, set the second heater to a temperature T2 at which no film is formed on the substrate and supply the precursor gas into the process container from the precursor gas supply pipe in the state in which the substrate is disposed on the mounting stand;
• in a third period after the second period, set the second heater to a film-forming temperature T3 which is smaller than the temperature T2 in the state in which the substrate is disposed on the mounting stand;
• and
• in the first period to the third period, set the first heater to a temperature T4, which is greater than the temperature T3, at which no film is formed on a periphery of a gas supply port of the precursor gas supply pipe by bonding the precursor gas that flows into the process container from the precursor gas supply pipe.