High throughput continuous operation reactor system

An offset, in-line vacuum processing system (100) for simultaneously processing substrates, having a common geometry or differing geometries, via one or more processes, said system (100) comprising:

• a. a plurality of process chambers (101) each configured to accommodate a given number of carriers that each hold a set of substrates, wherein each set of substrates are independently biased, wherein each process chamber is independently operable, held at vacuum pressure under independent pressure control, and configured to execute one or more steps in the one or more processes performed on each set of substrates;
• b. a transfer station (103) comprising a plurality of independently operable transfer chambers (105) that are collectively pressure controlled at vacuum pressure, wherein each transfer chamber is operatively coupled to one or more other transfer chambers and to one or more process chambers;
• c. a first load lock chamber (107) that is independently operable and held at vacuum pressure under independent pressure control;
• d. an entry holding station (113) that operatively couples a first transfer chamber of the transfer station (103) and the first load lock chamber (107), wherein the entry holding station (113) is independently operable and held at vacuum pressure under independent pressure control;
• e. an exit holding station (111) that is independently operable and held at vacuum pressure under independent pressure control, wherein the exit holding station (111) is operatively coupled to a last transfer chamber of the transfer station (103);
• and
• f. a second load lock chamber (109) that is independently operable and held at vacuum pressure under independent pressure control, wherein the second load lock chamber (109) is operatively coupled to the exit holding station (111),
• wherein one or more carriers are loaded into the first load lock chamber (107), wherein the entry holding station (113) accepts the one or more carriers from the first load lock chamber (107), optionally holds said carriers for a determined time period, and transmits the carriers to the first transfer chamber,
• wherein each carrier is routed through a designated sequence of process chambers for performing a designated process, of the one or more processes, wherein the plurality of transfer chambers is configured to transfer each carrier to and from each process chamber in the designated sequence,
• wherein each carrier is moved to the last transfer chamber after the designated process is complete and subsequently transferred to the exit holding station (111) to cool down for a predetermined time, wherein each carrier then exits the system (100) via the second load lock chamber (109),
• wherein each set of substrates is capable of being independently biased as each set is subject only to the designated process, wherein the system (100) is thus able to individually process each set of substrates whether having the common geometry or differing geometries, wherein each of the plurality of process and transfer chambers can be independently taken offline without affecting remaining process and transfer chambers as each are independently operable.

A method for simultaneously processing a plurality of substrates having differing geometries via one or more processes, said method comprising:

• a. providing an offset in-line vacuum processing system (100) comprising:
• i. a plurality of process chambers (101) each configured to accommodate a given number of carriers that each hold a set of substrates, wherein each set of substrates are independently biased, wherein each process chamber is independently operable, held at vacuum pressure under independent pressure control, and configured to execute one or more steps in the one or more processes performed on each set of substrates;
• ii. a transfer station (103) comprising a plurality of independently operable transfer chambers (105) that are collectively pressure controlled at vacuum pressure, wherein each transfer chamber is operatively coupled to one or more other transfer chambers and to one or more process chambers;
• iii. a first load lock chamber (107) that is independently operable and held at vacuum pressure under independent pressure control;
• iv. an entry holding station (113) that operatively couples a first transfer chamber of the transfer station (103) and the first load lock chamber (107), wherein the entry holding station (113) is independently operable and held at vacuum pressure under independent pressure control;
• v. an exit holding station (111) that is independently operable and held at vacuum pressure under independent pressure control, wherein the exit holding station (111) is operatively coupled to a last transfer chamber of the transfer station (103);
• and
• vi. a second load lock chamber (109) that is independently operable and held at vacuum pressure under independent pressure control, wherein the second load lock chamber (109) is operatively coupled to the exit holding station (111);
• b. loading one or more carriers into the first load lock chamber (107), wherein the entry holding station (113) accepts the one or more carriers from the first load lock chamber (107), optionally holds said carriers for a determined time period, and transmits the carriers to the first transfer chamber;
• c. routing each carrier through a designated sequence of process chambers for performing a designated process, of the one or more processes, wherein the plurality of transfer chambers is configured to transfer each carrier to and from each process chamber in the designated sequence;
• d. moving each carrier is to the last transfer chamber after the designated process is complete;
• e. transferring each carrier to the exit holding station (111) to cool down for a predetermined time;
• f. removing each carrier, holding a set of processed substrates, from the offset in-line vacuum processing system (100) via the second load lock chamber (109),
• wherein each set of substrates is capable of being independently biased as each set is subject only to the designated process, wherein the system (100) is thus able to individually process each set of substrates having differing geometries, wherein each of the plurality of process and transfer chambers can be independently taken offline without affecting remaining process and transfer chambers as each are independently operable.