Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source

A method of depositing a layer on a substrate, the method comprising:

• applying a first magnetic field to a cathode target, the first magnetic field generating an unbalanced magnetic field and a magnetron configuration on the cathode target;
• electrically coupling the cathode target to a first high power pulse resonance alternating current (AC) power supply;
• positioning an additional cylindrical cathode target electrode around the cathode;
• applying a second magnetic field to the additional cylindrical cathode target electrode, the second magnetic field forming a magnetron configuration on the cylindrical cathode target electrode;
• electrically coupling the additional cylindrical cathode target electrode to a second high power pulse resonance AC power supply;
• generating magnetic coupling between the cathode target and an anode;
• providing a feed gas;
• igniting plasma discharge with at least one of the first high power pulse resonance AC power supply, second high power pulse resonance AC power supply;
• and
• selecting a time shift between negative voltage peaks associated with AC voltage waveforms generated by the first high power pulse resonance AC power supply and the second high power pulse resonance AC power supply, the time shift increasing ionization of sputtered target material atoms associated with the cathode target during sputtering.